Multi-Model Server (MMS)

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XK1140 Workstation Standard
Lightweight and efficient AI solution.
Use Cases
- AI idea validation for developers
- Lightweight knowledge bases for SMEs
Core Advantages
- Ultimate Efficiency
- Cost-Effectiveness
- Rapid Deployment
Multi-Model AI Platform
- Multi-Model fusion architecture
- Cloud-Coordinated Model Caching
- Enterprise-grade knowledge base system
- Scenario-based agents
Technical Details
- 1-2x NVIDIA GeForce RTX 5090 Graphics Card, 32GB GDDR7 VRAM
- Intel® Core™ i9-14900KF 24-Core, 32-thread
- 2x 32GB 5200 MT/s DDR5
- 1TB M.2 NVMe SSD

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XK1270 Workstation Ultra
High-performance, real-time collaborative AI platform.
Use Cases
- Online customer service
- Real-time tasks
- Interactive data analysis
Core Advantages
- Outstanding Performance
- Real-Time Capabilities
- Team Collaboration
Multi-Model AI Platform
- Multi-Model fusion architecture
- Cloud-Coordinated Model Caching
- Enterprise-grade knowledge base system
- Scenario-based agents
- Enterprise-Grade Privacy
Technical Details
- 4x NVIDIA GeForce RTX 5090 Graphics Card, 32GB GDDR7 VRAM
- AMD Ryzen Threadripper, 24-Core, 48-thread
- 128GB 4800MHz DDR5
- 2TB NVMe SSD

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B200 Standard
Enterprise-grade, full-scale secure AI solution.
Use Cases
- Enterprise applications with high concurrency needs
- R&D and production environments with multiple users
Core Advantages
- Peak Performance
- Enterprise-Grade Security
- Scalability
Multi-Model AI Platform
- Multi-Model fusion architecture
- Cloud-Coordinated Model Caching
- Enterprise-grade knowledge base system
- Scenario-based agents
- Enterprise-Grade Privacy
Technical Details
- 8x NVIDIA Blackwell B200, 192GB HBM3e VRAM
- 2x Intel® Xeon Gold 6710E 64-Core, 64-thread
- 3072GB DDR5 RDIMM
- 15.36TB NVMe SSD
AI SERVER

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B300
10U AI Inference Server powered by NVIDIA HGX B200.
Technical Details
- Intel Xeon 6 Processors; Intel Xeon 6700-Series; Intel Xeon 6500-Series; Dual processor, TDP up to 350W
- 2 × LGA 4710 (Socket E2)
- System on Chip
- 8-Channel DDR5 RDIMM/MRDIMM, 32 × DIMMs; RDIMM up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM up to 8000 MT/s (Xeon 6 P-cores, 1DPC only)
- Front: 2 × 10Gb/s LAN (Intel X710-AT2, NCSI), 1 × 1GbE Mgmt; Rear: 8 × 800 Gb/s OSFP InfiniBand XDR / Dual 400 Gb/s Ethernet, 1 × 1GbE Mgmt
- ASPEED AST2600, 1 × VGA
- 8 × 2.5″ Gen5 NVMe hot-swap; 2 × M.2 (PCIe Gen5 x4/x2, 2280/22110)
- NVIDIA HGX B300 with 8 × SXM GPUs
- 4 × FHHL PCIe Gen5 x16 slots
- Front: 2 × USB 3.2 Gen1, 1 × VGA, 2 × RJ45, 1 × MLAN; Rear: 8 × OSFP, 1 × MLAN
- PCIe Gen5 x4
- 1 × TPM header (SPI); Optional TPM2.0 kit: CTM012
- 12 × 3000W 80 PLUS Titanium redundant, AC 115–240V (requires C19 cord)
- ASPEED AST2600 BMC, GIGABYTE Management Console web interface
- MB: 2 × 60×60×56mm, 4 × 60×60×76mm; OSFP: 4 × 40×40×56mm; PCIe: 2 × 80×80×56mm; GPU: 15 × 80×80×80mm
- Operating: 10–30 °C, 8–80% RH; Non-operating: –40–60 °C, 20–95% RH
- 1 × G894-SD3-AAX7, 2 × CPU heatsinks, 4 × Carriers, 1 × L-shape Rail kit
- 8U
- WxHxD – 448 x 930 x 353.6 mm (17.6 x 13.9 x 36.6 inch)
- Supports Intel® Xeon® 6700E/6700P Series Processors Dual Socket E E2 (LGA 4710) Max. TDP up to 350W
- NVIDIA HGXTM B300 8-GPU with NVIDIA NVSwitchTM GPU Memory: total 2.3TB HBM3e (8 x 288GB), TDP up to 1,100W
- 32 x DDR5 DIMM slots, up to 6400 MT/s
- • 12 x 2.5" Hot-swap NVMe Internal Storage: • 1 x M.2 2280/22110 NVMe
- 4 x PCIe 5.0 x16 FHHL
- 6+6, 80-PLUS Titanium, 3000W CRPS
- • 8 x NVIDIA ConnectX®-8 OSFP Ports (800Gb/s) • 2 x 1GbE RJ45 • 1 x IPMI RJ45 • 4 x USB 3.0 • 1 x VGA • Power button LED / UID button / reset button
- • 2 x 1GbE RJ45, shares with front panel • 1 x IPMI RJ45, shares with front panel • 2 x Type-A USB3.0 • 1 x VGA • UID button
- ASPEED® AST2600
- TPM 2.0
- • 2 x 1GbE RJ45 • 1 x IPMI RJ45
- • Windows Server • Linux • Vmware ESXi
- Air-cooled • 9 x 8080 rear fans • 10 x 8080 front fans • 6 x 6056 front fans • 5 x 8080 top fans
- • Operating Temperature: 10°C ~ 35°C • Non-operating temperature: -40°C ~ 70°C
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B200
10U AI Inference Server powered by NVIDIA HGX B200.
Technical Details
- 8U, 447x351x923mm (L*W*H)
- Intel® Xeon® 6 Processors Intel® Xeon® 6700-Series Processors Intel® Xeon® 6500-Series Processors; Dual processor, TDP up to 350W
- 2x LGA 4710, Socket E2
- System on Chip
- Integrated in Aspeed®AST2600 1xVGA port
- NVIDIA HGX™ B200 with 8 x SXM GPUs
- PCIe Bridge Board-CBG76: 8xFHHLx16 (Gen5x16), from PEX89104; PCIe Bridge Board-CBG045x2: 4xFHHLx16(Gen5x16), from PEX89048
- Front hot-swap: 8x2.5" Gen5 NVMe (NVMe from PEX89104) Internal M.2: 1xM.2(2280/22110), PCIe Gen5 x 4, from CPU 1; 1xM.2(2280/22110), PCIe Gen5 x 2, from CPU 1
- UEFI Secure Boot; SNMP Support:V3
- 32 x DIMM slots; DDR5 memory supported; 8-channel memory per processor; RDIMM: Up to 6400 MT/s (1DPC), 5200 MT/s (2DPC); MRDIMM: Up to 8000 MT/s
- Front(I/O board-CFPG440): 2x10Gb/s LAN(1x Intel®X710-AT2) Support NCSI function; 1x10/100/1000 Mbps Management LAN Rear (MLAN board-CDB66): 1x10/100/1000 Mbps Management LAN
- I/O board-CFG404: 2xUSB 3.2 Gen1 ports(Type-A); 1xVGA port; 2xRJ45 ports; 1xMLAN port (default); 1xPower button with LED; 1xID button with LED; 1xNMI button; 1xRest button; 1xStorage activity LED; 1xSystem status LED
- MLAN board-CDB66: 1xMLAN port
- 6+6 3000W 80 PLUS Titanium redundant power supplies [1] [1]The system power supply requires C19 power cord
- 8U Rackmount
- 930x448x353.6mm(36.6"x17.6" x13.9")
- Power button w/LED,reset button, NMI button,UID button
- System fault LED,hard drive activity LED
- 2 RJ45 (1GbE) by Intel®i350,share with rear I/O; 1 Dedicated IPMI, shares with rear I/O; 4 Type-A(USB3.2 Gen1); 1 DB15(VGA)
- 8 Hot-swap 2.5" NVMe (PCIe5.0 x 4) drive bays from PCIe switch; 2 Hot-swap 2.5" NVMe (PCIe5.0 x 4)/SATA drive bays form CPU
- 1 M-key (PCIe3.0x2 or SATA 6Gb/s), supports 2280/22110 form factor[PCH]; 1 M-key (PCIe3.0x4), supports 2280/22110 form factor[PCH]
- 6+6 CRPS
- 3002.4W@220-240Vac input 2900W@200-220Vac input
- 80-PLUS Titanium
- 200-240Vrms, 50/60Hz
- 29 PWM 80 x 80mm fans; 4 PWM 40 x40mm fans
- NVIDIA®HGX B200 8-GPU with NVIDIA® NVSwitch™
- Supports 5th and 4th Gen Intel® Xeon® Scalable Processors
- Dual Socket E(LGA4677)
- Up to 350W
- C741
- 16+16 DIMM slots (2DPC)
- RDIMM:96GB; RDIMM-3DS:2H-128GB/4H-256GB
- Rear: 8 HHHL PCIe5.0x16; 2 FHHL PCIe5.0x16
- Intel® i350:2 RJ45 (1GbE)
- ASPEED AST2600
- 1 Realtek RTL8211F for dedicated management GLAN
- ASPEED AST2600
- DDR4 512MB
- 1 UID button
- 1 DB15 (VGA)
- 2 Type-A (USB32 Gen1)
- 2 RJ45 (1GbE) by Intel®i350, share with front panel; 1 Dedicated IPMI shares with front panel
- CPU,MB,card side temperature sensing
- Fan tachometer; CPU Quiet Fan (allows chassis fan speed auto-adjust by CPU temperature); Fan multi-speed control
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XN8250
8U AI Inference Server powered by NVIDIA HGX H200 or H100.
Technical Details
- 2 x Intel® Xeon® Platinum 8558 Processor, 48 C, 2.1 GHz, 330 W
- 8 x NVIDIA HGX H200
- 32 x 64 G DDR5 RDIMM 5600 MT
- 4 x 3.84 TB U.2 NVMe SSD, 2 x 960 GB 2.5″ SATA SSD, 1 x onboard M.2 SSD (from PCH)
- Up to 8 x X16 PCIe slots (from PE switch), 2 x X16 PCIe slots (from CPU)
- BMC: AST2600, 1 x RJ45 Gigabit management network port
- CX7, MCX75310AAS-NEAT IB 400 G single OSFP (without optical module), BCM957608-P2200G dual port 200 G-QSFP56 (without optical module), BCM957412A4120AC dual port 10 G SFP+ (without optical module)
- 2 x USB Type-A ports, 1 x PWR BTN with LED, 1 x UID BTN with LED, 1 x Status LED, 1 x Console port, Type-C, 1 x Front VGA
- 15 x 8086 FANs, N+1 Redundant
- 5 °C – 35 °C
- 2 x 185 mm Redundant 2700 W HVDC/AC Input, 12 V Output PSUs, 6 x 185mm Redundant 3200W HVDC/AC Input, 54V Output PSUs
- 448 mm (H) x 352 mm (W) x 900 mm (L)
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